Infineon’s CYW20820 BLE SoC Will Adds Flexibility And High-Performance Connectivity To A System


Infineon Technologies has announced AIROC CYW20820 a device specially made for IoT applications. The CYW20820 is a Bluetooth & Bluetooth LE (low energy) system on chip (SoC) which is designed to be employed for a wide variety of applications such as home automation and sensors which will also add IoT functionality to the healthcare industry, home, security, etc.  The module features an ARM Cortex-M4 microcontroller unit with a floating-point unit. The AIROC modules are supported by ModusToolbox software and tool which also have code examples to simplify the process of development and integration of AIROC modules to other systems.

The module supports Infineon’s Modus Toolbox software and tools which can simplify the development process. The module is manufactured using the advance 40nm CMOS low-power process. The AIROC CYW20820 Bluetooth & Bluetooth LE SoC is powered by an ARM Cortex M4 microcontroller which helps the module offers reliable connectivity and low power with high-performance compute capability. The company claims that it is a highly integrated device with multiple digital interfaces, an optimized memory subsystem, and a power amplifier delivering up to 11.5 dBm transmit output power in LE and BR (basic rate) modes, thus reducing the device footprint and the costs associated with implementing Bluetooth solutions.

“The AIROC CYW20820 Bluetooth, Bluetooth LE SoC and modules are key additions to our portfolio and provide a solution that is low-power, cost-efficient and with scalable performance. With certified AIROC modules, Infineon is taking care of key steps in Bluetooth design to enable customers to have the quickest path to market.” said Sonal Chandrasekharan, Vice President of the Bluetooth product line at Infineon.

The company claims that it will introduce an AIROC Bluetooth module portfolio with 3 namely modules that include an onboard crystal oscillator, passive components, and the AIROC CYW20820 system on-chip. These modules are said to be highly integrated and are globally certified to support the fast time-to-market of IoT devices.

 





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